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The purpose of this Wiki is to provide a forum to discuss the challenges, and possible solutions, related to advanced integrated circuit manufacture.

3D-ICs Packaged and Unpackaged Evaluations and Qualifications (JC-14)

Scope: Develop qualification and evaluation test methods for stacked 3D integrated circuits (3DS-ICs).

Organization: JEDEC
Activity Type: Standard
Committee: Quality and Reliability of Solid State Products (JC-14)
Sub-committee: Test Methods for Packaged Devices (JC-14.1), Silicon Devices reliability

Key Contact: Ted Krueger

Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products (D5485) (10-01-2013)
Guide for CMP and Micro-bump Processes for Frontside TSV Integration (D5474) (10-01-2013)
Guide for Alignment Mark for 3DS-IC Process (D5473) (10-01-2013)
Test Method for Measuring Warp, Bow and TTV on Silicon and Glass Wafers Mounted on Wire Grids by Automated Non-Contact Scanning using Laser Scanning Interferometry (D5506) (10-01-2013)
Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures (D5447) (10-01-2013)
Specification for Glass Wafers for Use in Bonded Wafer Stacks (3D2-0113) PUBLISHED STANDARD (10-01-2013)
Middle End Process Task Force (25-05-2012)
Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks (D5409) (16-04-2012)
Wide IO DRAM Memory Specification – Low Power DRAM: Gen 2 (16-01-2012)
3DS IC Testing Task Force (12-01-2012)

SEMI Standard Activities (11-04-2013)
Specification for Glass Wafers for Use in Bonded Wafer Stacks (3D2-0113) PUBLISHED STANDARD (11-04-2013)
Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures (MS5-1211) PUBLISHED STANDARD (11-04-2013)
Guide for CMP and Micro-bump Processes for Frontside TSV Integration (D5474) (11-04-2013)
Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers (D5175) (11-04-2013)
Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures (D5410) (11-04-2013)
Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks (D5409) (11-04-2013)
Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack (D5173D) (11-04-2013)
3D Standards Dashboard (11-04-2013)
Wide IO DRAM Memory Specification – Low Power DRAM. PUBLISHED STANDARD: JESD229 (18-01-2013)

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