Welcome to the:
3D Interconnect Wiki: Standards for 3DS-ICs
Despite its high potential, a lack of uniform standards have slowed the migration of 3D technologies into mainstream production. In particular, cost-effective high-volume 3D integration of ICs from multiple sources will require the development of a cohesive set of end-to-end standards at the interfaces between supply chain partners.
The main objective of the 3DS-ICs Standard Activities Dashboard is to have a public and centralized website to provide easy to use links to the standard development organizations (SDOs) involved in standards development for 3DS-ICs. This site will allow the 3DS-IC community to define, track, provide status, find milestones, identify risk areas, and to determine gaps related to all necessary standards for the development, design, process, manufacturing, verification, and test of 3DS-ICs and associated package technologies.
We welcome your comments and participation on this wiki. We especially seek the 3DS-IC community’s help in identifying standards development activities that have not yet been captured on this dashboard. In addition, we seek to use this site to identify areas where standards are needed. You may put your suggestions as comments to these pages or send an email to Rich Allen at SEMATECH.
If you would like to comment, we do ask that you register following the link below and use your first and last name.
The community has, to date, identified standard relevant to 3D Stacked ICs from the following SDOs: