Rationale: This Guide will assist the user in selection and use of bond-void metrology tools based on their application and a protocol for performing bond-void measurements. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS-IC package sealing. The Guide will compare detection, in bonded wafer pairs, of prefabricated voids in several oxide thicknesses, the void detection limits of a range of metrology tools and provide application recommendations. This activity will be executed in a planned 3DS-IC project at SEMATECH. The test results and analysis will create a fundamental study of oxide-bonded wafer pairs. Subsequently this study can assist producers and users of other wafer bonding processes to develop robust products and evaluations.
Key Contact: Richard Allen