Rationale: Different technologies can measure various geometrical parameters of an individual TSV, or of an array of TSV's, such as pitch, top CD, top diameter, top area, depth, taper (or sidewall angle), bottom area, bottom CD, bottom diameter, and possibly others. However it is currently difficult to compare and/or correlate results from the various measurement technologies for various TSV dimensions. In some cases certain parameters may be described by similar names, but are actually different aspects of the TSV geometry. This standard will attempt to: a) Group the measurement results provided by the various technologies in such a way that correlations and comparisons are valid where possible; b) Clearly indicate the underlying issues in cases where valid comparisons and correlations are not geometrically valid.
Organization: SEMI
Domain: Terminology (D5269)
Committee: 3DS-IC
Task Force: Inspection and Metrology
Links:
Key Contact: David Read
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