Rationale: This guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together.
The August, 2012 version was balloted in Cycle 1, 2012, as part of its five-year review, with minor editorial changes.
Organization: SEMI
Domain: Mfg/Process
Activity Type: Published Standard (MS1-0812)
Committee: MEMS/NEMS
Task Force: Wafer Bond
Links:
Key Contact: Richard Allen
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