Rationale: Current wafer standards (SEMI M1) do not adequately address the needs of wafers used in bonded wafer stacks. Wafer thickness, edge bevel, notch, mass, bow/warp and diameters are changed when wafer stacks are bonded together, or wafer stacks bonded and thinned. These deviations from wafer parameters specified in SEMI M1 have numerous impacts in other equipment and hardware standards that reference SEMI M1, and SEMI drives a new standard to reflect wafer parameters associated with bonded and bonded/thinned wafer stacks.
This document will be balloted in Cycle 3 or Cycle 4, 2013, modified to address the negatives raised in the ballot of 5173C.
Key Contact: Richard Allen