SEMI Standard Activities

Introduction

Semiconductor Equipment and Materials International (SEMI) is the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries. One of its key services is the SEMI International Standards Programs, which produces standards in areas including materials, processes, and safety for the semiconductor, photvoltaic, and flat panel display industries.

List of Standard Activities/Listed by Committee and Task Force

    NA 3DS-IC Committee

• 3DS-IC Bonded Wafer Stacks (BWS) Task Force
  
  • Specification for Glass Wafers for Use in Bonded Wafer Stacks (3D2-0113) PUBLISHED STANDARD
  • Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack (D5173D)
  • Specification for Identification and Marking for Bonded Wafer Stacks (D5174)
• 3DS-IC Inspection and Metrology (I&M) Task Force
  • Guide for Terminology for Measured Geometrical Parameters of TSVs in 3DS-ICs (3D1-0912) PUBLISHED STANDARD
  • Guide for Detection and Characterization of Voids (D5270)
  • Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks (D5409)
    • NOW!  BALLOT PASSED SPRING 2013 SEMI MEETINGS
      
  • Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures (D5410)
    • NOW!  BALLOT PASSED SPRING 2013 SEMI MEETINGS
  • Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures (D5447)
  • Test Method for Measuring Warp, Bow, and TTV on Silicon and Glass Wafers Mounted on Wire Grids by Automated Non-Contact Scanning using Laser Scanning Interferometry (D5506)
• 3DS-IC Thin Wafer Handling Task Force
  • Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers (D5175)
    • NOW!  BALLOT PASSED SPRING 2013 SEMI MEETINGS

   Taiwan 3DS-IC Committee

• Middle End Process Task Force
  • Guide for Alignment Mark for 3DS-IC Process (D5473)
  • Guide for CMP and Micro-bump Processes for Frontside TSV Integration (D5474)
    • NOW!  BALLOT OPENED FEBRUARY 18, 2013!  Please Vote
• 3DS IC Testing Task Force
  • Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products (D5485)

    MEMS/NEMS Committee

• MEMS/NEMS Wafer Bond Task Force
  • Guide to Specifying Wafer-to-Wafer Bonding Alignment Targets (MS1-0812) PUBLISHED STANDARD
  • Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures (MS5-1211) PUBLISHED STANDARD
    • NOW!  BALLOT PASSED SPRING 2013 SEMI MEETINGS