Welcome to the:
3D Interconnect Wiki: Stress Management for TSVs
Management of mechanical stresses is one the key enablers for the successful implementation of 3D integrated circuits using through-silicon vias (TSVs). The stress-related impact of the processing done in various stages of the manufacturing supply chain must be characterized and shared, and designers need a solution like DFM for managing stress.
The purpose of this wiki is to provide a forum to discuss the solution, and to share tables of required material properties, measurement techniques and corresponding simulation use modes.